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  GIB2401 thru gib2404 vishay semiconductors formerly general semiconductor document number 88633 www.vishay.com 01-oct-03 1 dual ultrafast plastic rectifier reverse voltage 50 to 200v forward current 8.0a maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol GIB2401 gib2402 gib2403 gib2404 unit maximum repetitive peak reverse voltage v rrm 50 100 150 200 v maximum rms voltage v rms 35 70 105 140 v maximum dc blocking voltage v dc 50 100 150 200 v maximum average forward rectified current at t c = 125? i f(av) 16 a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) per leg at t c =100? i fsm 125 a typical thermal resistance per leg (note 1) r jc 1.2 ?/w operating storage and temperature range t j , t stg 65 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. maximum instantaneous i f = 4a, t j = 25? 0.900 forward voltage per leg at i f = 8a, t j = 25? v f 0.975 v i f = 4a, t j = 100? 0.800 i f = 8a, t j = 100? 0.895 maximum dc reverse current per leg t c = 25? i r 50 5.0 at rated dc blocking voltage t c =100? 150 500 a maximum reverse recovery time per leg at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 35 ns typical junction capacitance per leg at 4v, 1mh z c j 85 pf notes: (1) thermal resistance from junction to case per leg mounted on heatsink features ?plastic package has underwriters laboratory flammability classification 94v-0 ?dual rectifier construction, positive centertap ?glass passivated chip junctions ?low power loss ?high surge current capability ?superfast recovery times for high efficiency ?high temperature soldering in accordance with cecc 802 / reflow guaranteed mechanical data case: jedec to-263ab molded plastic body terminals: plated lead solderable per mil-std-750, method 2026 polarity: as marked mounting position: any weight: 0.05 oz., 1.35 g 0.380 (9.65) 0.411 (10.45) 0.320 (8.13) 0.360 (9.14) 0.591(15.00) 0.624 (15.85) 1 2 0.245 (6.22) min k k pin 1 pin 2 k - heatsink 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.014 (0.36) 0.021 (0.53) 0.110 (2.79) 0.140 (3.56) 0.110 (2.79) 0.090 (2.29) 0.047 (1.19) 0.055 (1.40) 0-0.01 (0-0.254) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) to-263ab dimensions in inches and (millimeters) 0.08 (2.032) 0.24 (6.096) 0.42 (10.66) 0.63 (17.02) 0.12 (3.05) 0.33 (8.38) mounting pad layout
GIB2401 thru gib2404 vishay semiconductors formerly general semiconductor www.vishay.com document number 88633 2 01-oct-03 ratings and characteristic curves (t a = 25 c unless otherwise noted) 0 25 50 75 150 125 100 1 100 10 peak forward surge current (a) number of cycles at 60 h z 0 12 16 20 0 25 50 75 100 125 150 average forward rectified current (a) case temperature ( c) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 fig. 3 ?typical instantaneous forward characteristics per leg 020 60 40 100 80 fig. 4 ?typical reverse leakage characteristics per leg instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) 8.0 4.0 resistive or inductive load t c = 125 c 8.3ms single half sine-wave (jedec method) infinite heatsink, t c ambient air rating, t a 0.01 0.1 10 1 80 instantaneous forward current (a) t j = 125 c t j = 25 c reverse voltage (v) junction capacitance (pf) 0.1 1 10 100 100 1,000 10 0.01 0.1 10 1 100 t j = 100 c fig. 5 ?typical junction capacitance per leg pulse width = 300 s 1% duty cycle t j = 125 c t j = 25 c t j = 25 c f = 1.0 mh z vsig = 50mvp-p fig. 1 ?maximum forward current derating curve fig. 2 ?maximum non-repetitive peak forward surge current per leg instantaneous forward voltage (v)


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